M2S150-1FCG1152
vs
M2S150-1FC1152
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
FBGA-1152
FBGA-1152
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
10 Weeks
10 Weeks
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
JESD-609 Code
e1
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
4
Number of Inputs
574
574
Number of Logic Cells
146124
146124
Number of Outputs
574
574
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Packing Method
TRAY
TRAY
Peak Reflow Temperature (Cel)
250
240
Programmable Logic Type
FPGA SOC
FPGA SOC
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.9 mm
2.9 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
35 mm
35 mm
Base Number Matches
2
2
Compare M2S150-1FCG1152 with alternatives
Compare M2S150-1FC1152 with alternatives