M2S150-1FCG1152 vs M2S150-1FC1152 feature comparison

M2S150-1FCG1152 Microchip Technology Inc

Buy Now Datasheet

M2S150-1FC1152 Microchip Technology Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description FBGA-1152 FBGA-1152
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 10 Weeks 10 Weeks
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e1 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4
Number of Inputs 574 574
Number of Logic Cells 146124 146124
Number of Outputs 574 574
Number of Terminals 1152 1152
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Packing Method TRAY TRAY
Peak Reflow Temperature (Cel) 250 240
Programmable Logic Type FPGA SOC FPGA SOC
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.9 mm 2.9 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 35 mm 35 mm
Base Number Matches 2 2

Compare M2S150-1FCG1152 with alternatives

Compare M2S150-1FC1152 with alternatives