M2S150T-1FC1152I
vs
RTAX2000S-1CGG624E
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
FBGA-1152
|
SPGA,
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
14 Weeks, 2 Days
|
|
| Samacsys Manufacturer |
Microchip
|
|
| JESD-30 Code |
S-PBGA-B1152
|
S-CPGA-P624
|
| JESD-609 Code |
e0
|
|
| Length |
35 mm
|
32.5 mm
|
| Number of Inputs |
574
|
|
| Number of Logic Cells |
146124
|
|
| Number of Outputs |
574
|
|
| Number of Terminals |
1152
|
624
|
| Operating Temperature-Max |
100 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
SPGA
|
| Package Equivalence Code |
BGA1152,34X34,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, SHRINK PITCH
|
| Packing Method |
TRAY
|
|
| Peak Reflow Temperature (Cel) |
240
|
NOT SPECIFIED
|
| Programmable Logic Type |
FPGA SOC
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.9 mm
|
2.78 mm
|
| Supply Voltage-Max |
1.26 V
|
1.575 V
|
| Supply Voltage-Min |
1.14 V
|
1.425 V
|
| Supply Voltage-Nom |
1.2 V
|
1.5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
BALL
|
PIN/PEG
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
PERPENDICULAR
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
35 mm
|
32.5 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
9A515.E
|
| Number of Equivalent Gates |
|
2000000
|
| Organization |
|
2000000 GATES
|
| Temperature Grade |
|
MILITARY
|
|
|
|
Compare M2S150T-1FC1152I with alternatives
Compare RTAX2000S-1CGG624E with alternatives