M2S150T-FCG1152I
vs
M2S150-1FCG1152I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
FBGA-1152
|
FBGA-1152
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
10 Weeks
|
10 Weeks
|
Samacsys Manufacturer |
Microchip
|
|
JESD-30 Code |
S-PBGA-B1152
|
S-PBGA-B1152
|
JESD-609 Code |
e1
|
e1
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of Inputs |
574
|
574
|
Number of Logic Cells |
146124
|
146124
|
Number of Outputs |
574
|
574
|
Number of Terminals |
1152
|
1152
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1152,34X34,40
|
BGA1152,34X34,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Packing Method |
TRAY
|
TRAY
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Programmable Logic Type |
FPGA SOC
|
FPGA SOC
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.9 mm
|
2.9 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare M2S150T-FCG1152I with alternatives
Compare M2S150-1FCG1152I with alternatives