M2S150TS-1FCVG484I
vs
M2S150TS-1FCVG484
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
VFBGA-484
|
VFBGA-484
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
10 Weeks
|
10 Weeks
|
Samacsys Manufacturer |
Microchip
|
|
Additional Feature |
LG-MIN, WD-MIN
|
LG-MIN, WD-MIN
|
JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
JESD-609 Code |
e1
|
e1
|
Length |
19 mm
|
19 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of Terminals |
484
|
484
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Packing Method |
TRAY
|
TRAY
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Programmable Logic Type |
FPGA SOC
|
FPGA SOC
|
Seated Height-Max |
3.15 mm
|
3.15 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
19 mm
|
19 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare M2S150TS-1FCVG484I with alternatives
Compare M2S150TS-1FCVG484 with alternatives