M38510/05151BCA vs HEC4013BDB feature comparison

M38510/05151BCA Texas Instruments

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HEC4013BDB NXP Semiconductors

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Pbfree Code Yes
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description CERAMIC, DIP-14 DIP,
Pin Count 14 14
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-GDIP-T14
JESD-609 Code e0
Length 19.56 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 1000000 Hz
Max I(ol) 0.0068 A
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.6 mA
Prop. Delay@Nom-Sup 825 ns
Propagation Delay (tpd) 825 ns 220 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 10 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 6.67 mm 7.62 mm
fmax-Min 24 MHz 7 MHz
Base Number Matches 5 1

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Compare HEC4013BDB with alternatives