M38510/05151BCX vs HEF4013BP feature comparison

M38510/05151BCX Renesas Electronics Corporation

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HEF4013BP NXP Semiconductors

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Package Description DIP, 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 825 ns 220 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 10 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 1 MHz 20 MHz
Base Number Matches 1 7
Pbfree Code Yes
Rohs Code Yes
Part Package Code MO-001
Pin Count 14
ECCN Code EAR99
Samacsys Manufacturer NXP
JESD-609 Code e4
Length 19.025 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 7000000 Hz
Package Equivalence Code DIP14,.3
Packing Method BULK
Prop. Delay@Nom-Sup 220 ns
Seated Height-Max 4.2 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 2.54 mm
Width 7.62 mm

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