M38510/07301BCB vs M38510/07301BCX feature comparison

M38510/07301BCB NXP Semiconductors

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M38510/07301BCX Lansdale Semiconductor Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SIGNETICS CORP LANSDALE SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family S S
JESD-30 Code R-XDIP-T14 R-GDIP-T14
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 9 ns 5.5 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 6
Length 19.56 mm
Peak Reflow Temperature (Cel) NOT APPLICABLE
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm

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