M38510/10901BPA vs CA0555CE feature comparison

M38510/10901BPA NXP Semiconductors

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CA0555CE Intersil Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Package Description DIP, PLASTIC, DIP-8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE; RECTANGULAR PULSE; RECTANGULAR
JESD-30 Code R-GDIP-T8 R-PDIP-T8
Length 9.6 mm 9.585 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.33 mm
Supply Voltage-Max (Vsup) 18 V 16 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm 7.62 mm
Base Number Matches 3 3
Rohs Code No
Part Package Code DIP
Pin Count 8
Moisture Sensitivity Level 1
Technology BIPOLAR

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