M38510/17204BCX vs HCC4077BF feature comparison

M38510/17204BCX Harris Semiconductor

Buy Now

HCC4077BF STMicroelectronics

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR STMICROELECTRONICS
Package Description DIP, CERAMIC, DIP-14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Logic IC Type XNOR GATE XNOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 350 ns 280 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 14
JESD-609 Code e0
Length 19.43 mm
Load Capacitance (CL) 50 pF
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 280 ns
Schmitt Trigger NO
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/17204BCX with alternatives

Compare HCC4077BF with alternatives