M38510/30703B2C
vs
74HCT139DB,112
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
LANSDALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QLCC
|
SSOP1
|
| Package Description |
QCCN, LCC20,.35SQ
|
SOT-338-1, SSOP-16
|
| Pin Count |
20
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
HCT
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
S-CQCC-N20
|
R-PDSO-G16
|
| Logic IC Type |
DECIMAL DECODER/DRIVER
|
2-LINE TO 4-LINE DECODER
|
| Max I(ol) |
0.004 A
|
0.004 A
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
SSOP
|
| Package Equivalence Code |
LCC20,.35SQ
|
SSOP16,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, SHRINK PITCH
|
| Power Supply Current-Max (ICC) |
13 mA
|
|
| Prop. Delay@Nom-Sup |
53 ns
|
51 ns
|
| Propagation Delay (tpd) |
53 ns
|
51 ns
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class B
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Manufacturer Package Code |
|
SOT338-1
|
| Factory Lead Time |
|
4 Weeks
|
| JESD-609 Code |
|
e4
|
| Length |
|
6.2 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
2 mm
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
5.3 mm
|
|
|
|
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