M38510/31502BCA
vs
N74LV393PW-T
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
LANSDALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP14,.3
|
TSSOP,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Count Direction |
UP
|
UP
|
| Family |
LS
|
LV/LV-A/LVX/H
|
| JESD-30 Code |
R-GDIP-T14
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
|
| Load/Preset Input |
YES
|
YES
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
29000000 Hz
|
|
| Max I(ol) |
0.004 A
|
|
| Mode of Operation |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Number of Bits |
4
|
4
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Power Supply Current-Max (ICC) |
15 mA
|
|
| Propagation Delay (tpd) |
81 ns
|
35 ns
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class B
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
1 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
| fmax-Min |
29 MHz
|
20 MHz
|
| Base Number Matches |
1
|
1
|
| Length |
|
5 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Seated Height-Max |
|
1.1 mm
|
| Width |
|
4.4 mm
|
|
|
|
Compare M38510/31502BCA with alternatives
Compare N74LV393PW-T with alternatives