M38510/65001BCX vs MC74HCT00ADR2 feature comparison

M38510/65001BCX Texas Instruments

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MC74HCT00ADR2 Motorola Semiconductor Products

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC MOTOROLA INC
Part Package Code DIP
Package Description DIP, SOP, SOP14,.25
Pin Count 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Length 19.56 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 21 ns
Propagation Delay (tpd) 135 ns 28 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm 3.9 mm
Base Number Matches 1 3
Rohs Code No
JESD-609 Code e0
Package Equivalence Code SOP14,.25
Packing Method TR
Terminal Finish TIN LEAD

Compare M38510/65001BCX with alternatives

Compare MC74HCT00ADR2 with alternatives