Findchips: Compare M38510/65005BCA vs 74HC00D,653

M38510/65005BCA vs 74HC00D,653 feature comparison

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Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	TELEDYNE E2V (UK) LTD	NXP SEMICONDUCTORS
Part Package Code	DIP	SOIC
Package Description	DIP, DIP14,.3	SO-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-GDIP-T14	R-PDSO-G14
JESD-609 Code	e0	e4
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.004 A	0.004 A
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
Package Code	DIP	SOP
Package Equivalence Code	DIP14,.3	SOP14,.25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE
Prop. Delay@Nom-Sup	29 ns	27 ns
Propagation Delay (tpd)	29 ns	135 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	YES	NO
Screening Level	MIL-M-38510 Class B
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	4.5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Finish	TIN LEAD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	1.27 mm
Terminal Position	DUAL	DUAL
Base Number Matches	2	2
Rohs Code		Yes
Manufacturer Package Code		SOT108-1
Length		8.65 mm
Moisture Sensitivity Level		1
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Seated Height-Max		1.75 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		3.9 mm
	Logic » Gates	Logic » Gates