M38510/65005BCA vs 74HC00N feature comparison

M38510/65005BCA QP Semiconductor

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74HC00N NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code DIP MO-001
Package Description DIP, 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 1630.6
CO2e (mg) 20219.441 20219.441
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 29 ns 135 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
ECCN Code EAR99
Samacsys Manufacturer NXP
Length 19.025 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO
Seated Height-Max 4.2 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/65005BCA with alternatives

Compare 74HC00N with alternatives