M38510/65005BCA
vs
74HC132D,652
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
QP SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
DIP
SOIC
Package Description
DIP,
SOT-108-1, SO-14
Pin Count
14
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-PDSO-G14
JESD-609 Code
e0
e4
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
29 ns
38 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510 Class B
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
TIN LEAD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Rohs Code
Manufacturer Package Code
SOT108-1
ECCN Code
EAR99
Length
8.65 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Package Equivalence Code
SOP14,.25
Packing Method
BULK
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
31 ns
Schmitt Trigger
YES
Seated Height-Max
1.75 mm
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Compare M38510/65005BCA with alternatives
Compare 74HC132D,652 with alternatives