M38510/65005BCA
vs
74HC132DB,118
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
QP SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
DIP
SSOP1
Package Description
DIP,
SOT-337-1, SSOP-14
Pin Count
14
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-PDSO-G14
JESD-609 Code
e0
e4
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd)
29 ns
38 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510 Class B
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
TIN LEAD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Rohs Code
Manufacturer Package Code
SOT337-1
Length
6.2 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Package Equivalence Code
SSOP14,.3
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
38 ns
Schmitt Trigger
YES
Seated Height-Max
2 mm
Terminal Pitch
0.65 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
5.3 mm
Compare M38510/65005BCA with alternatives
Compare 74HC132DB,118 with alternatives