M38510/65005BCA vs 74HCT132D-Q100 feature comparison

M38510/65005BCA e2v technologies

Buy Now

74HCT132D-Q100 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TELEDYNE E2V (UK) LTD NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 29 ns
Propagation Delay (tpd) 29 ns 50 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Screening Level MIL-M-38510 Class B AEC-Q100
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Rohs Code Yes
Samacsys Manufacturer NXP
Length 8.65 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

Compare M38510/65005BCA with alternatives