M38510/65005BCA vs M38510/65001BCA feature comparison

M38510/65005BCA QP Semiconductor

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M38510/65001BCA Texas Instruments

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Part Life Cycle Code Transferred Active
Ihs Manufacturer QP SEMICONDUCTOR INC TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 1630.6
CO2e (mg) 20219.441 20219.441
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-GDIP-T14
JESD-609 Code e0 e0
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 29 ns 135 ns
Qualification Status Not Qualified Qualified
Screening Level MIL-M-38510 Class B MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code No
Additional Feature LG-MAX
Length 19.94 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 21 ns
Schmitt Trigger NO
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare M38510/65005BCA with alternatives

Compare M38510/65001BCA with alternatives