M38510/65005BCA vs MM74HC00SJ feature comparison

M38510/65005BCA QP Semiconductor

Buy Now

MM74HC00SJ Rochester Electronics LLC

Buy Now Datasheet
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer QP SEMICONDUCTOR INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP SOIC
Package Description DIP, 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e3
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 29 ns 113 ns
Qualification Status Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 3
Pbfree Code Yes
Rohs Code Yes
Length 10.2 mm
Moisture Sensitivity Level 1
Seated Height-Max 2.1 mm
Terminal Pitch 1.27 mm
Width 5.3 mm

Compare M38510/65005BCA with alternatives

Compare MM74HC00SJ with alternatives