M38510/65005BCA
vs
MM74HCT00M
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
QP SEMICONDUCTOR INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP,
PLASTIC, SO-14
Pin Count
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
Family
HC/UH
HCT
JESD-30 Code
R-GDIP-T14
R-PDSO-G14
JESD-609 Code
e0
e0
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
29 ns
29 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510 Class B
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
2
5
Rohs Code
Length
8.65 mm
Load Capacitance (CL)
50 pF
Package Equivalence Code
SOP14,.25
Schmitt Trigger
NO
Seated Height-Max
1.75 mm
Terminal Pitch
1.27 mm
Width
3.9 mm
Compare M38510/65005BCA with alternatives