M38510/65005BCA vs SN74HC132APWRE4 feature comparison

M38510/65005BCA QP Semiconductor

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SN74HC132APWRE4 Texas Instruments

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC TEXAS INSTRUMENTS INC
Part Package Code DIP
Package Description DIP, TSSOP, TSSOP14,.25
Pin Count 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4
Average Weight (mg) 1630.6
CO2e (mg) 20219.441
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 29 ns 156 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Length 5 mm
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP14,.25
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm

Compare M38510/65005BCA with alternatives

Compare SN74HC132APWRE4 with alternatives