M38510/65005BCA vs TC74HC132AFN feature comparison

M38510/65005BCA QP Semiconductor

Buy Now

TC74HC132AFN Toshiba America Electronic Components

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC TOSHIBA CORP
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4
Average Weight (mg) 1630.6
CO2e (mg) 20219.441
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 29 ns 140 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Additional Feature NOT AVAILABLE IN JAPAN
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.25
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 28 ns
Schmitt Trigger YES
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

Compare M38510/65005BCA with alternatives

Compare TC74HC132AFN with alternatives