M38510/65005BCX vs 74HC132D feature comparison

M38510/65005BCX e2v technologies

Buy Now

74HC132D Toshiba America Electronic Components

Buy Now Datasheet
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer TELEDYNE E2V (UK) LTD TOSHIBA CORP
Part Package Code DIP
Package Description DIP, SOIC-14
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4
Average Weight (mg) 1630.6
CO2e (mg) 20219.441
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 29 ns 160 ns
Qualification Status Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 5 4
Rohs Code Yes
Factory Lead Time 20 Weeks
Date Of Intro 2016-05-25
Samacsys Manufacturer Toshiba
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Package Equivalence Code SOP14,.23
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 50 mA
Schmitt Trigger YES
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Compare M38510/65005BCX with alternatives