M38510/65005BCX vs 74HC132DR2G feature comparison

M38510/65005BCX e2v technologies

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74HC132DR2G onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD ON SEMICONDUCTOR
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 151.15
CO2e (mg) 20219.441 1874.26
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 29 ns 190 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 5 2
Rohs Code Yes
JESD-609 Code e3
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 38 ns
Schmitt Trigger YES
Seated Height-Max 1.75 mm
Terminal Finish Tin (Sn)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm

Compare M38510/65005BCX with alternatives

Compare 74HC132DR2G with alternatives