M38510/65005BCX vs 8403701CX feature comparison

M38510/65005BCX Motorola Mobility LLC

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8403701CX Intersil Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC HARRIS SEMICONDUCTOR
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 29 ns 135 ns
Qualification Status Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 5 5
Length 19.56 mm
Moisture Sensitivity Level NOT APPLICABLE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm

Compare M38510/65005BCX with alternatives

Compare 8403701CX with alternatives