M38510/65005BCX vs 933669030652 feature comparison

M38510/65005BCX Motorola Semiconductor Products

Buy Now

933669030652 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 29 ns 190 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 5 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 14
JESD-609 Code e4
Length 19.025 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 4.2 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare M38510/65005BCX with alternatives

Compare 933669030652 with alternatives