M38510/65005BCX vs GD74HCT132J feature comparison

M38510/65005BCX Motorola Semiconductor Products

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GD74HCT132J LG Semicon Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC LG SEMICON CO LTD
Package Description DIP, DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 29 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 7 2
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Power Supplies 5 V
Prop. Delay@Nom-Sup 38 ns
Schmitt Trigger YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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