M38510H05051BCX vs TC4011UBP feature comparison

M38510H05051BCX Intersil Corporation

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TC4011UBP Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 300 ns 110 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Total Dose 1M Rad(Si) V
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Length 19.25 mm
Load Capacitance (CL) 50 pF
Seated Height-Max 4.45 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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