M38510H05052BCX vs MC14023UBCL feature comparison

M38510H05052BCX Harris Semiconductor

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MC14023UBCL Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description DIP, DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 2
Number of Inputs 4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 490 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Total Dose 1M Rad(Si) V
Base Number Matches 2 4
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Package Equivalence Code DIP14,.3
Power Supplies 5/15 V
Prop. Delay@Nom-Sup 180 ns
Schmitt Trigger NO
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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