M38510H05053SCX vs HEF4093BP,652 feature comparison

M38510H05053SCX Intersil Corporation

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HEF4093BP,652 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 4
Number of Inputs 3 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 265 ns 185 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class S
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Total Dose 1M Rad(Si) V
Base Number Matches 2 1
Rohs Code Yes
Manufacturer Package Code SOT27-1
Samacsys Manufacturer NXP
JESD-609 Code e4
Length 19.025 mm
Load Capacitance (CL) 50 pF
Package Equivalence Code DIP14,.3
Packing Method BULK
Prop. Delay@Nom-Sup 185 ns
Schmitt Trigger YES
Seated Height-Max 4.2 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510H05053SCX with alternatives

Compare HEF4093BP,652 with alternatives