M4A3-256/160-12YNI vs XCR3256XL-7FT256C feature comparison

M4A3-256/160-12YNI Lattice Semiconductor Corporation

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XCR3256XL-7FT256C AMD

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code End Of Life End Of Life
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Part Package Code QFP
Package Description PLASTIC, QFP-208 FBGA-256
Pin Count 208
Reach Compliance Code compliant not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Additional Feature YES YES
Architecture PAL-TYPE
Clock Frequency-Max 52.6 MHz 154 MHz
In-System Programmable YES YES
JESD-30 Code S-PQFP-G208 S-PBGA-B256
JESD-609 Code e3 e0
JTAG BST YES YES
Length 28 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 160 164
Number of Macro Cells 256 256
Number of Terminals 208 256
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 160 I/O 0 DEDICATED INPUTS, 164 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP LBGA
Package Equivalence Code QFP208,1.2SQ,20 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 12 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 1.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 28 mm 17 mm
Base Number Matches 1 2

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