M4A3-256/192-10FANI vs M5LV-256/160-12YI feature comparison

M4A3-256/192-10FANI Lattice Semiconductor Corporation

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M5LV-256/160-12YI AMD

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Part Package Code BGA QFP
Package Description LEAD FREE, FPBGA-256 FQFP,
Pin Count 256 208
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES
Architecture PAL-TYPE
Clock Frequency-Max 62.5 MHz 71 MHz
In-System Programmable YES
JESD-30 Code S-PBGA-B256 S-PQFP-G208
JESD-609 Code e1
JTAG BST YES
Length 17 mm 28 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs
Number of I/O Lines 192 160
Number of Inputs 128
Number of Macro Cells 256
Number of Outputs 128
Number of Terminals 256 208
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 0 DEDICATED INPUTS, 192 I/O 0 DEDICATED INPUTS, 160 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FQFP
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 250
Programmable Logic Type EE PLD EE PLD
Propagation Delay 10 ns 17 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 3.95 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 17 mm 28 mm
Base Number Matches 1 3

Compare M4A3-256/192-10FANI with alternatives

Compare M5LV-256/160-12YI with alternatives