M4A3-256/192-7FAC
vs
M5LV-256/160-12YI
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
FPBGA-256
|
FQFP,
|
| Pin Count |
256
|
208
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
YES
|
|
| Clock Frequency-Max |
76.9 MHz
|
71 MHz
|
| In-System Programmable |
YES
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G208
|
| JESD-609 Code |
e0
|
|
| JTAG BST |
YES
|
|
| Length |
17 mm
|
28 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
192
|
160
|
| Number of Macro Cells |
256
|
|
| Number of Terminals |
256
|
208
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
0 DEDICATED INPUTS, 192 I/O
|
0 DEDICATED INPUTS, 160 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
FQFP
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
7.5 ns
|
17 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.1 mm
|
3.95 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
17 mm
|
28 mm
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare M4A3-256/192-7FAC with alternatives