M4A3-512/192-12FANI vs XCR3512XL-10FT256C feature comparison

M4A3-512/192-12FANI Lattice Semiconductor Corporation

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XCR3512XL-10FT256C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code End Of Life Transferred
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP XILINX INC
Part Package Code BGA BGA
Package Description LEAD FREE, FPBGA-256 FBGA-256
Pin Count 256 256
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Lattice Semiconductor
Additional Feature YES YES
Clock Frequency-Max 52.6 MHz 97 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
JTAG BST YES YES
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 192 212
Number of Macro Cells 512 512
Number of Terminals 256 256
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 192 I/O 0 DEDICATED INPUTS, 212 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 12 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 1.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 17 mm 17 mm
Base Number Matches 1 1
Factory Lead Time 12 Weeks

Compare M4A3-512/192-12FANI with alternatives

Compare XCR3512XL-10FT256C with alternatives