Findchips: Compare M54HC00F1 vs 74HCT00D,653

M54HC00F1 vs 74HCT00D,653 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	SGS-ATES COMPONENTI ELECTRONICI S P A	NXP SEMICONDUCTORS
Package Description	DIP, DIP14,.3	SO-14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	R-XDIP-T14	R-PDSO-G14
JESD-609 Code	e0	e4
Logic IC Type	NAND GATE	NAND GATE
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC	PLASTIC/EPOXY
Package Code	DIP	SOP
Package Equivalence Code	DIP14,.3	SOP14,.25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO	NO
Supply Voltage-Max (Vsup)	6 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Finish	Tin/Lead (Sn/Pb)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	1.27 mm
Terminal Position	DUAL	DUAL
Base Number Matches	2	2
Part Package Code		SOIC
Pin Count		14
Manufacturer Package Code		SOT108-1
Family		HCT
Length		8.65 mm
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Number of Functions		4
Number of Inputs		2
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		29 ns
Propagation Delay (tpd)		29 ns
Seated Height-Max		1.75 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		3.9 mm
	Logic » Gates	Logic » Gates