M54HC132D1 vs 74HC00DR2G feature comparison

M54HC132D1 STMicroelectronics

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74HC00DR2G onsemi

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS ONSEMI
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 LEAD FREE, SOIC-14
Pin Count 14 14
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-PDSO-G14
JESD-609 Code e0 e3
Length 19 mm 8.65 mm
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.00002 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 32 ns 22 ns
Propagation Delay (tpd) 160 ns 110 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 3.7 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Total Dose 50k Rad(Si) V
Width 7.62 mm 3.9 mm
Base Number Matches 1 2
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260

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