M54HC237D1
vs
CD74HC137E
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
STMICROELECTRONICS
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP, DIP16,.3
DIP-16
Pin Count
16
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
Input Conditioning
LATCHED
JESD-30 Code
R-CDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
20.32 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
OTHER DECODER/DRIVER
Max I(ol)
0.004 A
0.004 A
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
INVERTED
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
0.08 mA
Prop. Delay@Nom-Sup
54 ns
54 ns
Propagation Delay (tpd)
270 ns
225 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.83 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
50k Rad(Si) V
Width
7.62 mm
Base Number Matches
1
5
Additional Feature
ADDRESS LATCHES
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