M54HC4050BF1 vs TC74HC4050F feature comparison

M54HC4050BF1 STMicroelectronics

Buy Now Datasheet

TC74HC4050F Toshiba America Electronic Components

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.1V; IOL = 6MA @ VOL = 0.4V CMOS-TTL LEVEL TRANSLATOR
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 26 ns 125 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5 mm 5 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare M54HC4050BF1 with alternatives

Compare TC74HC4050F with alternatives