M54HCT00F1R vs CD74HCT00E feature comparison

M54HCT00F1R STMicroelectronics

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CD74HCT00E General Electric Solid State

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer STMICROELECTRONICS GENERAL ELECTRIC SOLID STATE
Part Package Code DIP
Package Description DIP, DIP14,.3 DIP-14
Pin Count 14
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT
JESD-30 Code R-GDIP-T14 R-PDIP-T14
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 29 ns 30 ns
Propagation Delay (tpd) 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 7

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