M66010GP
vs
M66010GP
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MITSUBISHI ELECTRIC CORP
|
| Part Package Code |
SSOP
|
SOIC
|
| Package Description |
SSOP, SOP32,.4,32
|
SSOP, SOP32,.4,32
|
| Pin Count |
32
|
32
|
| Manufacturer Package Code |
PRSP0032GA
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Clock Frequency-Max |
2.5 MHz
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
R-PDSO-G32
|
R-PDSO-G32
|
| Length |
12.8 mm
|
12.8 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
24
|
24
|
| Number of I/O Lines |
24
|
24
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Equivalence Code |
SOP32,.4,32
|
SOP32,.4,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.55 mm
|
2.55 mm
|
| Supply Voltage-Max |
6 V
|
6 V
|
| Supply Voltage-Min |
2 V
|
2 V
|
| Supply Voltage-Nom |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.5 mm
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|