M74AS760P vs 74LVTH32244GX feature comparison

M74AS760P Mitsubishi Electric

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74LVTH32244GX Fairchild Semiconductor Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MITSUBISHI ELECTRIC CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code DIP BGA
Package Description DIP, DIP20,.3 LFBGA, BGA96,6X16,32
Pin Count 20 96
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW ENABLE LOW
Family AS LVT
JESD-30 Code R-PDIP-T20 R-PBGA-B96
JESD-609 Code e0 e0
Length 24 mm 13.5 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.064 A 0.064 A
Number of Bits 4 1
Number of Functions 2 32
Number of Ports 2 2
Number of Terminals 20 96
Operating Temperature-Max 75 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Output Characteristics OPEN-COLLECTOR 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP LFBGA
Package Equivalence Code DIP20,.3 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE GRID ARRAY, LOW PROFILE, FINE PITCH
Power Supply Current-Max (ICC) 94 mA
Prop. Delay@Nom-Sup 20 ns 3.5 ns
Propagation Delay (tpd) 6.5 ns 3.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.5 mm 1.4 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO YES
Technology TTL BICMOS
Temperature Grade COMMERCIAL EXTENDED INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE BALL
Terminal Pitch 2.54 mm 0.8 mm
Terminal Position DUAL BOTTOM
Width 7.62 mm 5.5 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3
Packing Method TR

Compare M74AS760P with alternatives

Compare 74LVTH32244GX with alternatives