M74HC00B1N
vs
TC74HC00APF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
TOSHIBA CORP
Part Package Code
DIP
DIP
Package Description
DIP, DIP14,.3
0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14
Pin Count
14
14
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
23 ns
19 ns
Propagation Delay (tpd)
23 ns
95 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
5.1 mm
4.45 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Samacsys Manufacturer
Toshiba
Length
19.25 mm
Packing Method
TUBE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare M74HC00B1N with alternatives
Compare TC74HC00APF with alternatives