M74HC00F1
vs
74HC00NB
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SGS-ATES COMPONENTI ELECTRONICI S P A
NXP SEMICONDUCTORS
Package Description
DIP, DIP14,.3
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T14
R-PDIP-T14
JESD-609 Code
e0
Logic IC Type
NAND GATE
NAND GATE
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Family
HC/UH
Length
19.025 mm
Load Capacitance (CL)
50 pF
Number of Functions
4
Number of Inputs
2
Propagation Delay (tpd)
27 ns
Seated Height-Max
4.2 mm
Width
7.62 mm
Compare 74HC00NB with alternatives