M74HC08B1R vs CD74HC08EX feature comparison

M74HC08B1R STMicroelectronics

Buy Now Datasheet

CD74HC08EX Intersil Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS INTERSIL CORP
Part Package Code DIP
Package Description PLASTIC, DIP-14 DIP-14
Pin Count 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
Family HC/UH
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e4 e0
Length 19.43 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Prop. Delay@Nom-Sup 22 ns 27 ns
Propagation Delay (tpd) 110 ns
Qualification Status Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 3

Compare M74HC08B1R with alternatives