M74HC112M1R
vs
M38510/30106BEB
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
SIGNETICS CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP16,.25
|
DIP,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Family |
HC/UH
|
LS
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDIP-T16
|
| JESD-609 Code |
e4
|
|
| Length |
9.9 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
J-K FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
27000000 Hz
|
|
| Max I(ol) |
0.004 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
2
|
1
|
| Number of Functions |
2
|
6
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Propagation Delay (tpd) |
190 ns
|
52 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
NEGATIVE EDGE
|
POSITIVE EDGE
|
| Width |
3.9 mm
|
|
| fmax-Min |
32 MHz
|
25 MHz
|
| Base Number Matches |
1
|
3
|
| Screening Level |
|
MIL-PRF-38535 Class B
|
|
|
|
Compare M74HC112M1R with alternatives
Compare M38510/30106BEB with alternatives