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M74HC132B1R vs 74HC132DB-T feature comparison

M74HC132B1R STMicroelectronics

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74HC132DB-T NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS NXP SEMICONDUCTORS
Part Package Code DIP SSOP
Package Description PLASTIC, DIP-14 SOT-337-1, SSOP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 16 Weeks
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e4 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 32 ns
Propagation Delay (tpd) 160 ns 38 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES
Seated Height-Max 5.1 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 5.3 mm
Base Number Matches 1 1
Length 6.2 mm
Moisture Sensitivity Level 1

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