M74HC132F1 vs 74HC00N feature comparison

M74HC132F1 SGS-Ates Componenti Electronici SPA

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74HC00N NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SGS-ATES COMPONENTI ELECTRONICI S P A NXP SEMICONDUCTORS
Package Description DIP, DIP14,.3 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Logic IC Type NAND GATE NAND GATE
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code MO-001
Pin Count 14
ECCN Code EAR99
Samacsys Manufacturer NXP
Family HC/UH
Length 19.025 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Number of Functions 4
Number of Inputs 2
Packing Method TUBE
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns
Seated Height-Max 4.2 mm
Width 7.62 mm

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