M74HC132F1 vs 74HC03DB-Q100 feature comparison

M74HC132F1 STMicroelectronics

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74HC03DB-Q100 Nexperia

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS NEXPERIA
Part Package Code DIP
Package Description DIP, DIP14,.3 SSOP,
Pin Count 14
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Prop. Delay@Nom-Sup 31 ns
Propagation Delay (tpd) 31 ns 145 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 5 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.3 mm
Base Number Matches 2 2
Date Of Intro 2017-02-01
Length 6.2 mm
Moisture Sensitivity Level 1
Output Characteristics OPEN-DRAIN
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) 30

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