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M74HC132F1 SGS-Ates Componenti Electronici SPABuy Now Datasheet |
74HCT132D,652 NXP SemiconductorsBuy Now Datasheet |
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| Rohs Code | No | Yes |
| Part Life Cycle Code | Obsolete | Transferred |
| Ihs Manufacturer | SGS-ATES COMPONENTI ELECTRONICI S P A | NXP SEMICONDUCTORS |
| Package Description | DIP, DIP14,.3 | SOP, SOP14,.25 |
| Reach Compliance Code | unknown | compliant |
| JESD-30 Code | R-XDIP-T14 | R-PDSO-G14 |
| JESD-609 Code | e0 | e4 |
| Logic IC Type | NAND GATE | NAND GATE |
| Number of Terminals | 14 | 14 |
| Operating Temperature-Max | 85 °C | 125 °C |
| Operating Temperature-Min | -40 °C | -40 °C |
| Package Body Material | CERAMIC | PLASTIC/EPOXY |
| Package Code | DIP | SOP |
| Package Equivalence Code | DIP14,.3 | SOP14,.25 |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | IN-LINE | SMALL OUTLINE |
| Power Supplies | 2/6 V | 5 V |
| Qualification Status | Not Qualified | Not Qualified |
| Schmitt Trigger | YES | YES |
| Surface Mount | NO | YES |
| Technology | CMOS | CMOS |
| Temperature Grade | INDUSTRIAL | AUTOMOTIVE |
| Terminal Finish | Tin/Lead (Sn/Pb) | NICKEL PALLADIUM GOLD |
| Terminal Form | THROUGH-HOLE | GULL WING |
| Terminal Pitch | 2.54 mm | 1.27 mm |
| Terminal Position | DUAL | DUAL |
| Base Number Matches | 2 | 2 |
| Part Package Code | SOIC | |
| Pin Count | 14 | |
| Manufacturer Package Code | SOT108-1 | |
| HTS Code | 8542.39.00.01 | |
| Family | HCT | |
| Length | 8.65 mm | |
| Load Capacitance (CL) | 50 pF | |
| Max I(ol) | 0.004 A | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 4 | |
| Number of Inputs | 2 | |
| Packing Method | BULK PACK | |
| Peak Reflow Temperature (Cel) | 260 | |
| Prop. Delay@Nom-Sup | 41 ns | |
| Propagation Delay (tpd) | 50 ns | |
| Seated Height-Max | 1.75 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 3.9 mm | |
