M74HC132F1 vs TC74HCT00AFN feature comparison

M74HC132F1 SGS-Ates Componenti Electronici SPA

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TC74HCT00AFN Toshiba America Electronic Components

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SGS-ATES COMPONENTI ELECTRONICI S P A TOSHIBA CORP
Package Description DIP, DIP14,.3 SOP, SOP14,.25
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDSO-G14
JESD-609 Code e0
Logic IC Type NAND GATE NAND GATE
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Additional Feature NOT AVAILABLE IN JAPAN
Family HCT
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 24 ns
Propagation Delay (tpd) 24 ns
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

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